EPO-TEK® 360 Low Viscosity Epoxy, Heat Cure (4g)

The EPO-TEK^® 360 Low Viscosity, Optical Epoxy is a two-component, high-temperature grade epoxy is designed for semiconductor, electronics, and fiber optics applications. Recommended Cure: 150°C (302°F) for 1 Hour. Available in 4 gram packet.

Features:

• Pot Life: 6 hours
• Built-in color change from clear to amber when fully cured, enabling in-line inspection of joints and fillets
• Unfilled epoxy resin allows for % transmission in the VIS and NIR to be realized.
• Low viscosity allows for wicking and capillary action

Applications:

• Semiconductor: Capillary-flow underfill for flip-chip mounted die
• Fiber Optic:
  • Polarization-maintaining fibers (PMF) used in gyroscope coils
  • Fiber termination into ferrules
• Electronics: Impregnates copper coil windings in motors or SMD inductor coils and provides strong adhesion to ferrite cores.

Physical Properties:

• Consistency: Pourable liquid
• Viscosity (23°C): 350-550 cPs
• Glass Transition Temperature, Tg: ≥ 90°C (degree Celsius); ≥ 194°F (degree Fahrenheit)
• Coefficient of Thermal Expansion (CTE):
  • Below Tg: 39 x 10^-6 in/in°C
  • Above Tg: 175 x 10^-6 in/in°C
• Shore D Hardness: 87
• Suggested Operating Temperature: < 300 °C (Intermittent); < 572°F

Optical Properties @ 23°C (73.4°F):

• Spectral Transmission:
  • > 97% @ 700 – 1600 nm
  • > 88% @ 600 nm
  • > 51% @ 500 nm
• Refractive Index (uncured): 1.5345 @589 nm

See Datasheet for additional properties and application notes