Holiday Update: We will resume our regular business hours on Tuesday, January 21.
Fiber Optic Center will be closed Monday, January 20 in observance of Martin Luther King Jr. Day.
Epoxy and Adhesive Supplies
- REQUEST A SAMPLEÅngströmBond® AB9123 High Temperature Epoxy, Heat Cure (2.5g)
The ÅngströmBond® 9123 Epoxy is a very fast-curing, high-temperature fiber optic connecto...
Part: AB9123-2.5G - REQUEST A SAMPLEÅngströmBond® AB9123 High Temperature Blue Epoxy, Heat Cure (2.5g)
The ÅngströmBond® 9123 Blue Epoxy is a very fast-curing, high-temperature fiber optic con...
Part: AB9123BLUE-2.5G - REQUEST A SAMPLEEPO-TEK® 353ND High Temperature Epoxy, Heat Cure (2.5g)
The EPO-TEK® 353ND Epoxy is a two-component, high-temperature epoxy designed for semiconductor, hybr...
Part: ET353ND-2.5G - REQUEST A SAMPLEÅngströmBond® AB9320 Blue Epoxy, Heat Cure (2.5g)
The ÅngströmBond® 9320 is a low stress, heat cured blue epoxy designed for terminating multimode and...
Part: AB9320-2.5G - REQUEST A SAMPLEÅngströmBond® AB9320 Clear Epoxy, Heat Cure (2.5g)
The ÅngströmBond® 9320 Epoxy is a low stress, heat cured clear epoxy designed for termina...
Part: AB9320CLR-2.5G - REQUEST A SAMPLEÅngströmBond® AB9112 MIL-SPEC Fiber Optic Epoxy, Room Temperature & Heat Cure (2.5g)
The ÅngströmBond® 9112 MIL-SPEC Epoxy is a blue, room temperature and heat curing fiber o...
Part: AB9112-2.5G - Domaille CO-6500 Epoxy Curing Oven with MT Tray - 110V
The Domaille Engineering CO-6500 Universal Epoxy Curing Oven (110/120V) featuring an MT 24-position ...
Part: CO-6500-MT - REQUEST A SAMPLEÅngströmBond® AB9113SC Epoxy, Room Temperature & Heat Cure (2.5g)
The ÅngströmBond® 9113SC is a blue, fiber optic connector epoxy based on one of the most ...
Part: AB9113SC-2.5G - REQUEST A SAMPLEÅngströmBond® AB9110LV Clear Epoxy for PM and POF fiber, Room Temperature & Heat Cure (2.5g)
The ÅngströmBond® 9110LV is a low viscosity, clear epoxy recommended for industrial adhes...
Part: AB9110LV-2.5G - REQUEST A SAMPLEÅngströmBond® AB9110LV Blue Epoxy for PM and POF fiber, Room Temperature & Heat Cure (2.5g)
The ÅngströmBond® 9110LVBL is a blue, low viscosity epoxy recommended for industrial adhesive, small...
Part: AB9110LVBL-2.5G - REQUEST A SAMPLEÅngströmBond® AB9001MTUP Thixotropic Clear Epoxy, Room Temperature & Heat Cure (2.5g)
The ÅngströmBond® 9001MTUP Clear Epoxy is a two-part, room temperature and heat curing ad...
Part: AB9001MTUP-2.5G - Dymax BlueWave® 200 UV Curing Spot Lamp with Foot Switch (V3.1)
The Dymax BlueWave® 200 UV Epoxy Curing Spot Lamp version 3.1 is a high-intensity, light-curing syst...
Part: 41015 - REQUEST A SAMPLEÅngströmBond® AB9001MT Thixotropic Epoxy, Room Temperature & Heat Cure (2.5g)
The ÅngströmBond® 9001 MT Epoxy is a two-part, room temperature curing adhesive designed specificall...
Part: AB9001MT-2.5G - Fisnar DC100 MAX Digital Epoxy Dispensing Machine
The Fisnar DC100 MAX Epoxy and Adhesive Dispenser is a versatile, high-precision adhesive and epoxy ...
Part: DC100 MAX - REQUEST A SAMPLEEPO-TEK® 353ND High Temperature Epoxy, Heat Cure (4g)
The EPO-TEK® 353ND Epoxy is a two-component, high-temperature epoxy designed for semiconductor, hybr...
Part: ET353ND-4G - EPO-TEK® 353ND High Temperature Epoxy, Heat Cure (8oz)
The EPO-TEK® 353ND Epoxy is a two component, high-temperature epoxy designed for semiconductor, hybr...
Part: ET353ND-8OZ - REQUEST A SAMPLEEPO-TEK® 353ND High Temperature Black Epoxy, Heat Cure (2.5g)
The EPO-TEK® 353ND Black Epoxy is a two-component, high-temperature epoxy designed for semiconductor...
Part: ET353NDBLK-2.5G - REQUEST A SAMPLEEPO-TEK® 353NDT Thixotropic High Temperature Epoxy, Heat Cure (2.5g)
The EPO-TEK® 353ND-T Epoxy is a two-component, highly thixotropic epoxy with non-flowing properties ...
Part: ET353NDT-2.5G - LW Scientific E8 Centrifuge - Touch Screen
The LW Scientific E8 Centrifuge is engineered for superior performance, offering higher speeds for f...
Part: E8C-U8AT-15T3 - REQUEST A SAMPLEEPO-TEK® 383ND High Temperature Epoxy, Heat Cure (2.5g)
The EPO-TEK® 383ND Epoxy is a two-component, high-temperature, electrically and thermally insulating...
Part: ET383ND-2.5G - REQUEST A SAMPLEEPO-TEK® 323LP High Temperature Epoxy, Heat Cure (2.5g)
The EPO-TEK® 323LP Epoxy is a two-component, high-temperature epoxy designed for semiconductor, hybr...
Part: ET323LP-2.5G - REQUEST A SAMPLEEPO-TEK® 360 Low Viscosity Epoxy, Heat Cure (4g)
The EPO-TEK® 360 Epoxy is a two-component, high-temperature epoxy for semiconductor, electronics, an...
Part: ET360-4G - ÅngströmBond® ÅnaeBond™ AB101 Fast Cure Anaerobic Adhesive (10ml Adhesive and 1.75oz Primer)
The ÅngströmBond® AnaeBond™ 101 is a single-component anaerobic adhesive that rapidly dev...
Part: AB101-10ML - ÅngströmBond® ÅnaeBond™ AB202 Fast Cure Adhesive, Room Temperature Cure (20ml Adhesive and 1.75oz Primer)
The ÅngströmBond® ÅnaeBond™ AB202 Fast Cure Adhesive is a superior optical adhesive desig...
Part: AB202-20ML
Epoxy and Adhesive Supplies
Fiber Optic Center offers Epoxies & Adhesives in the following areas: Room Temperature Cure, Extended Use / Heat Cure, Quick Cure Field Termination Adhesives, UV Cure Adhesives and Specialty Adhesives. Please contact Fiber Optic Center with your application and we will be happy to find you the appropriate material.
Epoxy centrifuge and mixing equipment is also critical for the centrifugation, mixing, degassing, dispensing and curing that removes air bubbles and ensures proper ratios. Epoxy curing equipment and epoxy dispensing equipment selection are both critical for ensuring fiber performance. Considerations often include viscosity and heat requirements of the specific materials as well as other attributes.